Category

 Attributes

 2009

 2009 / 2010

2011

 Fine Line / Space

Inner Layers (Line / Sapce)
Outer Layers (Line / Space)

2.5 / 2.5 mil
2.5 / 2.5 mil

 2.0 / 2.0 mil
 2.0 / 2.0 mil

  25 / 25 microns
  25 / 25 microns

 Holes

Mechanical (Drilled Hole / Land)
Laser Drill (Drilled Hole / Land)

 5.9 / 12 mil
4 / 8 mil

 4 / 10 mil
3 / 6 mil

 4 / 6 mil
3 / 6 mil

 Special Processing

Controlled Depth Drilling - Blind Vias
Sequential Lamination - Burried Vias
Via in Pad Technology - Silver Epoxy
Via in Pad Technology - Non Conductive
Edge Plating

Yes
Yes
Yes
Yes
Yes

Yes
Yes
Yes
Yes
Yes

Yes
Yes
Yes
Yes
Yes

 Materials

High TD - RoHS
Halogen Free
High Performance
Polyimide - High Temp
Teflon
High Speed RF Signals

CEM 1, CEM 3, FR370HR, Ventec VT47,
ITEQ IT180, FR4 STD, Arlon, Duroid,
Nelco 4000-13, Isola 410, Getek,
BT, Rogers 3010 / 4000 / 5880, Taconic,
Ventec VT46 (High Speed Low Loss),
Polyimide (Kapton, Ventec VT90)

Yes
Yes
Dk=3.0 Df<0.005
Yes
Yes
Yes

Yes
Yes
Dk< 3.0 Df<0.003 Yes
Yes
Yes
Yes

Yes
Yes
Dk<3.0 Df<0.002
Yes
Yes
Yes

 Thru Via Holes

Minimum Pad Size
Registration to Internal Land
Maximum Copper Plating Aspect Ratio
Minimum Feature to Edge

8 mil 
+5.0 mil
25:1
5 mil

8 mil
+4.5 mil
25:1
5 mil

8 mil
+4 mil
27:1
5 mil

 PCB / Panel

Maximun Layer Count
Maximum Thickness
Maximum Process Panel Size

50 Layers
0.42"
24" x 30"

60 Layers
0.62"
24" x 30"

60 Layers +
0.90"
24" x 30"

        Impedance

Resistors
Capacitance / Capacitors

 +20%
2 mil Core

 +15%
1 mil Core

 +10%
Thin Film

 Surface Finish

 HASL, Lead Free HASL, ENIG, Immersion Tin,
Immersion Silver, OSP, Carbon Ink, 
Electrolytic Hard & Soft Gold,
Palladium, Nickel

 Yes

 Yes

 Yes

 Certifications

 ISO9000, ISO14001, IPC 6013 Class 1, 2 & 3,
TL9000, QS9000, TS16949, MIL-PRF-31032,
MIL-PRF-55110, MIL-P-50884, U.L.

 Yes

 Yes

 Yes

 Registrations

 I.T.A.R.

 Yes

 Yes

 Yes