Products- Rigid
- Rigid-Flex
- Flex
- Hybrid Construction RF & Digital
- Metal Core
- Aluminum Backed
- Cavity Boards
- Embedded Passives
- Backpanels
- Heavy Copper up to 10 oz
| Capabilities- Quick Turn Prototypes (as quick as 12 hours)
- Low Volume / High Mix
- Medium Volume
- High Volume
- RFQ Response within 24 hours
- DFM Review and Analysis
- Printed Circuit Board Design
- 1 to 50 layers
- 25:1 Drill Aspect Ratio
- HDI
- Back Drilling
- Maximum Panel Size 24" x 30"
- Via in Pad with Filled Vias (Conductive, Non Conductive, CU Plug)
- Stocking Programs (Kan-Ban, On Site, JIT, Pay as you Pull)
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